J. KIMS Technol Search

CLOSE


Journal of the Korea Institute of Military Science and Technology 2004;7(1):34-46.
Effects of electrode configurations on uniformity of copper films on flexible polymer substrate prepared by ECR-MOCVD
,
ECR-MOCVD에 의해 연성 고분자 기판에 제조된 구리막의 균일도에 전극의 형태가 미치는 영향
전법주, 이중기
한국과학기술연구소
Abstract
Copper films were prepared by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The DC bias is connected to the electrode which placed 1∼3cm above the polymer substrate. The pulse electrical field around the electrode attracts the positive charged copper ions generated from the dissociation of copper precursor, $Cu(hfac)_2$, under ECR plasma. Condensation of supersaturated copper ions in the space between the electrode and substrate, makes it possible to deposit copper film on the polymer substrate even at room temperature. In this study, optimization of the electrode configuration was carried out in order to obtain the uniform films. The uniformity of the deposited films were closely related to the parameters of electrode geometry such as electrode shape, thickness, grid size and the spacing between electrodes. The most uniform copper film was observed with the electrode that enabled uniform electrical field distribution across the whole dimension of electrode.
Key Words: Electron Cyclotron Resonance, MOCVD, DC Bias, Uniformity, Electrode, Surface Resistance
TOOLS
Share :
Facebook Twitter Linked In Google+ Line it
METRICS Graph View
  • 195 View
  • 0 Download
Related articles in J. KIMS Technol.

Characteristics of copper/C films on PET substrate prepared by ECR-MOCVD at room temperature2003 September;6(3)



ABOUT
ARTICLE CATEGORY

Browse all articles >

BROWSE ARTICLES
FOR CONTRIBUTORS
Editorial Office
160 Bugyuseong-daero 488beon-gil, Yuseong-gu, Daejeon 34060, Korea
Tel: +82-42-823-4603    Fax: +82-42-823-4605    E-mail: kimst@kimst.or.kr                

Copyright © 2022 by The Korea Institute of Military Science and Technology.

Developed in M2PI

Close layer
prev next