| Characteristics of copper/C films on PET substrate prepared by ECR-MOCVD at room temperature |
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Joong-Kee Lee, Bup-Ju Jeon, Jin Hyun, Dong-Jin Byun |
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| 상온 ECR-MOCVD에 의해 제조되는 Cu/C박막특성 |
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이중기, 전법주, 현진, 변동진 |
1한국과학기술연구원
2고려대학교 |
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| Abstract |
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Cu/C films were prepared at room temperature under $Cu(hfac)_2-Ar-H_2$ atmosphere in order to obtain metallized polymer by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The room temperature MOCVD on polymer substrate could be possible by collaboration of ECR and a DC bias. Structural analysis of the films by ECR was found that fine copper grains embedded in an amorphous polymer matrix with indistinctive interfacial layer. The increase in $H_2$ contents brought on copper-rich film formation with low electric resistance. On the other hand carbon-rich films with low sheet electric resistance were prepared in argon atmosphere. The electric sheet resistance of Cu/C films with good interfacial property were controlled at $10^8$~$10^0$ Ohm/sq. ranges by the $H_2$/Ar mole ratio and the shielding effectiveness of the film showed maximum up to 45dB in the our experimental range. |
| Key Words:
ECR, MOCVD, DC bias, Electric Sheet Resistance, Shielding effectiveness |
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