| A Study on Adhesive Crosslinked in Low Temperature for High Temperature Aerospace Application |
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Jung Kun Song, Hyun Ryul Woo, Geum Mi Lee, Doo Hyun Choi |
1The 4th Research and Development Institute, Agency for Defense Development
2CNC R&D Group Kukdo |
| 우주항공용 저온 경화 접착제의 고온 물성에 관한 연구 |
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송정근, 우현률, 이금미, 최두현 |
1국방과학연구소 제4기술연구본부
2국도화학 CNC 소재연구개발 |
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| Abstract |
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A high temperature adhesive development which is crosslinked in low temperature is necessary for aerospace application because of thermal expansion mismatches of various substrates. For this purpose, we have designed and fabricated several formulations with high temperature epoxy resins, crosslinkers and additives considering various working conditions and high service temperature. As a result, some formulations showed higher adhesive strengths than Hysol EA 9394/C2 which is widely used for aerospace applications. We also have studied and summarized the mechanical properties of the best development adhesive in both room and high temperatures. |
| Key Words:
High Temperature Properties, Aerospace Adhesive |
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