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- Study on Reliability of Lead-free mixed BGA Soldering Process for Application of Space-grade PBA
- Yeongmin Hong, Mungwan Kwak, Suhyeon Jeon
- J. KIMS Technol. 2025;28(1):52-59. Published online February 5, 2025
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- Study on Vibration and Thermal Characteristics Applying Staking to CCGA Package for Space Applications
- Myung Deuk Jeong, Sunghoon Jung, Young Min Hong
- J. KIMS Technol. 2020;23(6):574-581. Published online December 5, 2020
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